DESCRIPTION: Inductively coupled plasma etching system
Nation of Principal:Germany
Product Application:SiO2, SINx, SiOxNy, and a-Si
in a temperature range of RT
to 350 °C Related Link:http://www.sentech.de/
Keyword:PECVD
1.PECVD with highly process flexibility on temperature & film
2.Vacuum loadlock with cleanliness of deposition processes
3.Available for the deposition of TEOS, SiC, and other materials with liquid or gaseous precursors
4.up to 200mm wafer
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