JEL Robot ServiceMHI
1.Suppose that two wafers are rigidly bonded at room temperature….such a dreamy idea is realized by SAB (Surface Activated Bonding).
2.Wafers are irradiated with atoms or ions in a vacuum.
3. Oxide film and absorption layers are removed and dangling bond will appear on the bonding surface.
4. These activated surface will be bonded only by touching each other.