DESCRIPTION： Our systems enable you to check: Wafers and bonded wafers MEMS Die structures Stack dies Flip Chips Power electronics CMOS Image Sensors Molded Components Packaging
Nation of Principal：Germany Product Application：Semiconductor Related Link：https://www.pvatepla-sam.com/en/products/sam-line/ Keyword：Scanning Acoustic Tomography(SAT); scanning acoustic microscope(SAM)
Detection of cavities, voids, bubbles, inclusions, and delamination and are ideally suitable for wafer inspection, bond checking, and package inspection
