微機電系統 MHI
1.Suppose that two wafers are rigidly bonded at room temperature….such a dreamy idea is realized by SAB (Surface Activated Bonding).
2.Wafers are irradiated with atoms or ions in a vacuum.
3. Oxide film and absorption layers are removed and dangling bond will appear on the bonding surface.
4. These activated surface will be bonded only by touching each other.
2.Wafers are irradiated with atoms or ions in a vacuum.
3. Oxide film and absorption layers are removed and dangling bond will appear on the bonding surface.
4. These activated surface will be bonded only by touching each other.